Wafer Thickness Mapping System
TMS-2000 uses an interferometric detection technique with a high-speed tunable laser to measure the flatness of the wafer up to 1nm repeatability for global, site and edge measurements of the wafer. Thanks to its high-speed measurement capability and compact size, the TMS-2000 can be used in various industrial fields involving in-line inspection.
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- Wafer Thickness Mapping System
- TMS-2000
High Repeatability Model